Copper pyrophosphate

CAS: 10102-90-6
Molecular Formula: Cu2O7P2
Molecular Weight: 301.04
Product description:1. It is mainly used for cyanide electroplating, is Lord of the supply of copper ion in plating solution of salt. Suitable for decorative coating copper layer and the request of the local seepage control of carburized parts of carbon coating. Used in pyrophosphate copper plating, bronze plating, nickel plating, copper tin alloy plating and tungsten alloy plating, etc., also used for analysis reagent. 2. The pyrophosphate copper mainly used as pyrophosphate copper plating of the main salt. Pyrophosphate copper is the main source of supply of copper ion in plating solution, commodity pyrophosphate copper copper content of 38% or so, the general control of copper content in liquid copper plating for 20 ~ 25 g/L, shiny copper content in copper plating liquid control in 25 ~ 35 g/L.