Bisphenol F

CAS: 620-92-8
Molecular Formula: C13H12O2
Molecular Weight: 200.24
Product description:(1) epoxy resin With bisphenol F as raw materials of epoxy resin and bisphenol A as raw materials of epoxy resin, compared with characteristics of low viscosity, good job, can be applied to no solvent to ultra high solid coatings, also can be applied to the lining materials, floor materials, note type materials, impregnated materials, laminated materials, and other fields. (2) polycarbonate resin Made from bisphenol a and phosgene F polycarbonate resin soluble in methylene chloride and other low boiling point solvents, low softening point, good formability, even in the very big damage to use scalability, suitable for molding material or membrane, etc. (3) polyester resin Bisphenol F epoxy silane and addition of biphenyl type of glycol, and dibasic acid resin was prepared by reaction, low viscosity, mechanical properties and chemical properties are excellent, especially suitable for manufacturing of corrosion resistant material. (4) other Bisphenol F can also be used for production of oil soluble phenolic resin, flame retardant, antioxidant and surface active agent, etc.